CUSTOM HI-REL SCREENING
( Similar to MIL-PRF-55310, "Class S" Screening )
When required by the customer, Xsis oscillators can be subjected to the following screening
tests on a 100% basis. PDA for burn-in & Non-Destruct Bond Pull are in accordance with the requirements of MIL-PRF-55310 for
"class S" products.
| Non-Destruct Bond Pull |
MIL-STD-883, Method 2023 ( PDA=2% or 1 wire whichever is greater ) |
| Internal Visual |
MIL-STD-883, Method 2017, Class "S", Except Class "B" for Elements |
| Stabilization Bake |
MIL-STD-883, Method 1008, Cond. C, 48 Hours Minimum |
| Thermal Shock |
MIL-STD-883, Method 1011, Cond. A |
| Temperature Cycling |
MIL-STD-883, Method 1010, Cond. B |
| Constant Acceleration |
MIL-STD-883, Method 2001, Cond. A, Y1 only, ( 5000 G ) |
| Seal - fine & gross leak |
MIL-STD-883, Method 1014 |
| PIND |
MIL-STD-883, Method 2020, Cond. A |
| Radiographic Insp. |
MIL-STD-883, Method 2012 |
| Electrical Tests | MIL-PRF-55310, Class B |
| Burn-in |
+125 °C, Nominal Supply Voltage & Burn-in Load, 320 Hours Min. |
| Electrical Tests | MIL-PRF-55310, Class B |
Xsis Electronics Inc. • 12620 Shawnee Mission Pkwy • Shawnee • Kansas • 66216
Tel: 913-631-0448 · Fax: 913-631-1170 · e-mail: xsis@xsis.com